Brass Plated Steel Sawing Wire
Fine-gauge brass plated steel sawing wire plays an irreplaceable role in the production of solar wafers. The thickness of the silicon wafer cutting wire on the market is generally 120 microns. In order to reduce the loss of silicon blocks, fine-gauge and high-strength consumables are required as cutting accessories. According to the technology, ultra-fine specification high-strength brass plated steel sawing wire is a necessity for silicon wafer production. This Cutting wire as a consumable material is widely used in energy and utilities, aviation, equipment fields. Such as, solar wafer cutting, quartz material, monocrystalline silicon, polycrystalline silicon, etc.
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Jiangyin Baoneng Precision New Material Co.,LTD , https://www.baonengwire.com