Introduction of packaging technology of LED explosion-proof lamp

1. LED packaging technology is developed on the basis of discrete device packaging technology, but it has great specificity. In general, the dies of discrete devices are sealed in the package body, and the role of the package is mainly to protect the dies and complete the electrical interconnection. The second LED package is to complete the function of outputting electrical signals, protecting the normal operation of the die, and outputting visible light. There are both electrical parameters and optical parameter design and technical requirements. It is not easy to use discrete device packages for LEDs.

2. Brief description of LED packaging process:

1. Fix the LED chip to the bracket with high thermal conductivity glue;

2. Put it on the binding machine and connect the positive and negative poles of the LED with the positive and negative poles of the bracket with money;

3. Fill the bracket with phosphor

4. Sealant

5. Testing and sorting

This is just a brief description. The specific production process in the book needs to be designed according to the chips, brackets and auxiliary materials (with phosphor, glue, etc.) and their equipment used in production.

The auxiliary materials determine the LED's luminous angle, luminous color, heat dissipation capacity and processing technology.