New Trends in CAD-CAM Data Conversion (3)

2.1.3 Introduction to development institutions and organizations

Since EDIF 4.0.0 belongs to the CAD-CAM interconnection development team, its members are mostly the world's most famous EDA suppliers and some influential associations in the electronics industry, mainly by: EIA, IPC, Manchester University (University) Organizations and organizations such as Manchester, Mentor Graphics, Solectron and Hadco Santa Clara.

2.2 IPC-2510 Series Standard

2.2.1 Objective

The IPC-2510 series of standards is based on the GenCAD format (released by Mitron) and was finalized in 1998. Ultimately, it establishes a flexible communication method between electronic EDA and PCB fabrication, assembly, and testers, specifies the standard format for data conversion, and promotes it to OEMs (source device manufacturers) and contract manufacturers in the electronics industry. This standard type of file includes information such as layout, pad, patch, instrumentation, and in-line signal lines. Almost all of the externally processed PCB data can be extracted from the GenCAM (GenCAD expansion and addition) parameters.

2.2.2 Main content

The IPC-2510 series of standards have many individual standards and are interdependent. Now only the IPC-2511, ie GenCAM, is the main description.

GenCAM files include 20 types of content:

Hey. Header—the beginning of each file, including the name, company file type, quantity, version, etc.

Hey. Board—a description of a PCB board, such as a wheel gallery;

Hey. Land pattern—Land pattern geometry with solder paste, silk screen, and drill holes;

Hey. Pad—contains vias and their pad information in CAD system data;

Hey. Shape—a complex physical shape description;

Hey. Component - the name used to distinguish the component;

Hey. Device - component description information, including device number;

Hey. Signal-netlist information;

Hey. Wire-wire information, such as width, thickness, etc.

Hey. Layer/structure-plate information description, including layer number, solder mask, thickness, etc.

Hey. Wiring—wire physical information, including light mapping information;

Hey. Mechanical-mechanical related information such as positioning, holes, auxiliary items, etc.;

Hey. Test point—test point location, name, type;

Hey. Power supply - ground line, power line information description;

Hey. Alias—Use the user to convert to other file formats;

Hey. Change—identifies the modification;

Hey. Affiliate—not characteristic geometric information related to the circuit, such as logos, graphics, etc.

Hey. Electrical principle - related design circuit principle information, mainly used to arrange the test sequence;

Hey. Layout - PCB production layout (such as imposition), assembly arrangement and other related information;

Hey. ECO—Information about electrical inspections and modifications.

The details of the IPC-2511 series of standards are not here, and the IPC-2510 series of standards has just been issued, and the practical significance of its application is obvious.

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Other Testing Device And Components

Other Testing device and Components

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